Samsung Electronics expects to increase savings on die area in the shift from its 10nm to 7nm node by applying both EUV for critical layers and several layout-focused process changes.
Samsung Electronics will describe at the upcoming VLSI Symposia how its engineers have applied EUV to a variety of layers in a 7nm finFET process.
Mentor's west coast user conference will take place in Santa Clara on May 15. Attendance is free-of-charge.
LSG generates random design-like test vehicles to enable more detailed pre-ramp analysis for incoming nodes.
Placement-aware synthesis and an array of post-layout recovery steps have helped drive up the clock speed and silicon utilization of a series high-end SoCs on leading-edge processes developed by customers of Synopsys' implementation tools.
EUV and fin optimization help build Samsung's upcoming 7nm process, the company discloses at the VLSI Technology Symposium.
Among the papers at this year's VLSI Symposia in Hawaii in June, Samsung will describe a 7nm CMOS process that uses EUV lithography to tighten up device features on minimum-pitch interconnects.
The major West Coast technical conference for lithography is just two weeks away and offers a packed agenda.
STMicroelectronics, Samsung, GSI Technology and Synopsys talk about the challenges of doing AMS design on finFET processes.
Synopsys video details challenges of 10nm design and its collaboration with Samsung Semiconductor to build a full flow to address them.
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