Among the papers at this year's VLSI Symposia in Hawaii in June, Samsung will describe a 7nm CMOS process that uses EUV lithography to tighten up device features on minimum-pitch interconnects.
“It’s the time between putting out an open-source ARM core and getting a letter from an ARM lawyer,” says UC Berkeley professor Krste Asanovic. So, some design teams are turning to IP that started out as open source to provide more scope for experimentation.
Design for test could look quite different in five years' time compared to the situation designers have today as chipmakers wrestle with the problems of yield control, safety, and aging.
The Calibre vendor will have a strong technical presence at the leading lithography conference taking place in late February in San Jose.
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
Is the industry ready to go beyond 10nm when it comes to lithography? Lithography researcher Professor David Pan sees design and process co-operation as the key approach.
IBM to offer end-to-end IC design flow on its own infrastructure in PAYG EDA model.
Intel 14nm finFET SoC process is among the highlights of the 2015 VLSI Symposia alongside research that looks at the integration of III-V and 2D materials for future processes.
Foundry veteran Simon Yang told Semicon China while things are looking up the country cannot count on ‘traditional’ methods or advantages if it's to be a major chipmaker.
The International Electron Device Meeting (IEDM) has once again provided a chance for the major chipmakers to go head-to-head with their latest processes - this time with finFETs.
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