PDK enables photonics prototyping on MPW runs and compatibility with volume production at STMicroelectronics at Crolle.
Two leading European research institutes presented their work on the feasibility and cost-effectiveness of monolithic 3D integration at this year's IEDM.
Intel and GlobalFoundries will talk about their post-14nm finFET-based processes at December's IEDM.
Researchers describe at IEDM 2015 how they are making gallium nitride fit into a wider range of power-handling applications and may even result in mass-market vertical transistors.
Silicon Impulse program adds partners to ease industrialisation of ultra-low power IC designs based on FD-SOI processes
CEA-Leti has launched a design center called Silicon Impulse with the intention of lowering the entry barrier to using the FD-SOI process.
The FD-SOI technology developed by CEA-Leti and STMicroelectronics is beginning to gain ground as chipmakers investigate the process as a way to deliver low-energy, wireless-capable SoCs.
As plans crystallize to take FD-SOI down to 10nm, CEA-Leti argues that the technology can provide an alternative path to that of finFETs to get to 7nm processes and beyond.
At IEDM 2014, CEA-Leti presented a technique that prevents damage to base-layer transistors in monolithic 3DIC processes. As work progresses, the institute is preparing to receive 3DIC designs in 2017.
At the VLSI Technology Symposium a team led by STMicroelectronics described the techniques used for the upcoming 14nm FD-SOI to boost speed and density over the 28nm version.
View All Sponsors