Trend Analysis & Interviews

The white heat of technology

We report from National Instruments’ annual user conference, NIWeek 2011, held in a sizzling Austin last month.

The testiest place on earth

But in a good way. As ITC moves to Anaheim’s Disneyland in September, we preview the 2011 edition.
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The Universal Verification Methodology: ready, set, deploy

Mentor’s Dennis Brophy, Cadence’s Stan Krolikoski and Synopsys’ Yatin Trivedi describe how you can prepare to adopt Accellera’s Universal Verification Methodology.

Parting of the ways

Intel says ‘trigate’—finFET to others—but depleted silicon-on-insulator also has its post 22nm supporters. Chris Edwards reports on the debate at 2011’s Semicon West.

This one now goes to 12

We quiz TSMC’s Tom Quan on the latest methodological challenges being addressed by the world’s largest foundry’s signature Reference Flow.
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Opening up the dialogue

A bid for more interactivity is one of the program cornerstones for the 48th Design Automation Conference.
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Balancing devices and manufacturing

Fab owners are looking to bring down their energy consumption to match the greening of semiconductors themselves.
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The new semiconductor ecosystem: wants and needs

Leading chip design analyst Gary Smith charts the course through the main questions dominating DAC 2011.
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Pointers from DAC

This issue of Tech Design Forum takes manufacturing as its main focus—as is entirely appropriate in the run up to a Design Automation Conference (DAC) that will be marked by the roll-out of the 28/32nm process node to the wider community. We have contributions this issue from both main foundry groups, TSMC and GlobalFoundries, and [...]

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The trillion dollar mark

Optimism and caution characterized this year's Consumer Electronics Show in Las Vegas

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