thermal budget


December 18, 2023

FD-SOI processes lead to double-decker monolithic 3D

At IEDM, CEA-Leti described a process that avoids the thermal problems of implementing CMOS transistors in the metal stack using monolithic integration.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
January 7, 2015

CEA-Leti deals with heat issue on monolithic 3DIC

At IEDM 2014, CEA-Leti presented a technique that prevents damage to base-layer transistors in monolithic 3DIC processes. As work progresses, the institute is preparing to receive 3DIC designs in 2017.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: ,

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