SOI


June 1, 2023

X-Fab introduces BCD-on-SOI at 110nm

X-Fab Silicon Foundries claims to be the first with a foundry offering for 110nm BCD-on-SOI technology, aimed primarily at automotive designers.
Article  |  Topics: Blog - IP  |  Tags: , , , ,   |  Organizations:
October 14, 2019

Integration forms highlights of upcoming IEDM

Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
October 3, 2019

X-Fab expands MPW access through Europractice

Mixed-signal foundry X-Fab has expanded the range of processes that it will offer for prototyping through the Europractice service.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
April 12, 2019

DesignWare gets automotive boost with GLOBALFOUNDRIES 22FDX SOI qualification

Synopsys and GLOBALFOUNDRIES are developing a portfolio of automotive IP for the chipmakerā€™s 22nm fully depleted silicon-on-insulator (22FDX) process.
Article  |  Topics: Blog - IP  |  Tags: , , , ,
July 11, 2018

Leti and Soitec partner for wafer development

Research institute Leti and Soitec have decided to team up to work on a new generation of engineered substrates, such as specialized SOI wafers.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
June 25, 2015

X-Fab updates 180nm SOI process for automotive and industrial applications

Foundry claims isolation and device integration advantages for 180nm SOI process, help to absorb extra costs of SOI wafers
Article  |  Topics: Blog - EDA, - Product  |  Tags: , , , , ,   |  Organizations:
April 29, 2015

Automotive integration led by cabling concerns, says NXP

Cabling and its weight are helping to drive integration and a shift towards wireless communication within cars, says NXP's automotive CTO.
August 12, 2013

CDNLive Boston to tackle mixed-signal design, host exhibit

Taking place in Chelmsford, MA on 27 August, the conference will feature user-authored papers, tutorials, a designer expo and keynotes from Cadence and IBM.
October 15, 2012

FinFETs face planar fightback at IEDM

Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM
Article  |  Topics: Commentary, Conferences, Blog - EDA  |  Tags: , , , , , ,   |  Organizations: ,

PLATINUM SPONSORS

Synopsys Cadence Design Systems Siemens EDA
View All Sponsors