SIP


November 6, 2018

Netronome launches chiplet initiative for network-accelerator SIPs

Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.
Article  |  Topics: Blog - EDA, IP, PCB  |  Tags: , , ,   |  Organizations: , , , ,
June 18, 2017

TSMC encapsulates CoWoS for supersized SiP

TSMC encapsulated the multiple chips assembled on a 1200mm2 silicon substrate to cut the chance of damage from warping with the company's CoWoS2 SiP technology.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , ,   |  Organizations:
June 5, 2017

Mentor builds links for multichip package integration

Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , , , ,   |  Organizations: ,
May 30, 2017

Cadence pulls Virtuoso and Allegro closer for 3DIC

Cadence Design Systems has brought its chip- and PCB-design environments closer together as the shift towards multichip packages gains pace.
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May 19, 2017

FinFET-project growth ‘stunning’ says EDA exec

Machine learning, smarter cars, and the infrastructure to support a sixfold increase in IoT and edge devices have helped push up the number of teams doing finFET designs to more than 100, according to Tom Beckley of Cadence.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations:
June 1, 2015

Avago and Broadcom: integration of another kind?

Last week's announcement by Avago that it would buy Broadcom looks to be only partly about bulk. The merger could help drive SIP and 3DIC integration.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , , ,   |  Organizations:
May 20, 2014

Vorsprung durch 3D technik for Audi

The automotive sector could become one of the key markets for 3D integration according to the head of Audi's progressive semiconductor program.
Article  |  Topics: Blog - EDA, Embedded, IP  |  Tags: , , , ,

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