Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.
TSMC encapsulated the multiple chips assembled on a 1200mm2 silicon substrate to cut the chance of damage from warping with the company's CoWoS2 SiP technology.
Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
Cadence Design Systems has brought its chip- and PCB-design environments closer together as the shift towards multichip packages gains pace.
Machine learning, smarter cars, and the infrastructure to support a sixfold increase in IoT and edge devices have helped push up the number of teams doing finFET designs to more than 100, according to Tom Beckley of Cadence.
Last week's announcement by Avago that it would buy Broadcom looks to be only partly about bulk. The merger could help drive SIP and 3DIC integration.
The automotive sector could become one of the key markets for 3D integration according to the head of Audi's progressive semiconductor program.
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