RF


January 31, 2017

Overcome IoT edge challenges with integrated flows

IoT edge designs are being undertaken by multi-disciplinary teams that must work within the tightest of budgets.
Article  |  Topics: Blog - EDA, Embedded, PCB  |  Tags: , , , , , , , , , , ,   |  Organizations:
November 11, 2016

Webinar focuses on Eldo RF verification of Tanner-based designs

On-demand seminar explains how to exploit recently announced integration of Tanner and Eldo suites for sensor, IoT and other design types.
Article  |  Topics: Blog - EDA, - Product, Verification  |  Tags: , , , , , , ,   |  Organizations: ,
March 22, 2016

Spectrum analyzers aim for IoT projects

Tektronix has aimed a pair of RF instruments at the growing number of engineering teams trying to incorporate low-power wireless communications into their designs.
Article  |  Topics: Blog - Embedded, PCB  |  Tags: , , ,   |  Organizations:
July 13, 2015

GlobalFoundries tunes 28nm for smaller, lower-power FD-SOI

GlobalFoundries has developed variants of the 28nm FD-SOI process that offer smaller die sizes and lower-power operation.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
August 8, 2014

Custom instrumentation helps build models for more advanced RF amplifiers

High peak-to-average ratios inherent in 4G/5G modulation schemes are driving the circuitry controlling RF PAs to become more modeling-oriented.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , , , , ,   |  Organizations:
August 7, 2014

NI aims to bring design and production closer with chip-test plan

National Instruments plans to build an ecosystem around semiconductor test that could provide a missing link between the design process and production.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: ,

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