RF


July 12, 2018

With RF, power and MRAM, FD-SOI finds its role

FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , , , ,   |  Organizations: , , ,
June 20, 2018

SAR-VCO combo tunes RF receiver power on 16nm

Researchers from the UC Berkeley and Intel teamed up to develop an energy-tuneable RF front-end on a digital finFET process with no need for analog process options.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: ,
February 15, 2018

FPGA powers custom RF tests on low-cost module

Slovenian startup Red Pitaya has added a front-end module and firmware to its FPGA-based StemLab board to create a customizable vector network analyzer (VNA) and RF tester.
Article  |  Topics: Blog - Embedded  |  Tags: , , , , , ,
January 31, 2017

Overcome IoT edge challenges with integrated flows

IoT edge designs are being undertaken by multi-disciplinary teams that must work within the tightest of budgets.
Article  |  Topics: Blog - EDA, Embedded, PCB  |  Tags: , , , , , , , , , , ,   |  Organizations:
November 11, 2016

Webinar focuses on Eldo RF verification of Tanner-based designs

On-demand seminar explains how to exploit recently announced integration of Tanner and Eldo suites for sensor, IoT and other design types.
Article  |  Topics: Blog - EDA, - Product, Verification  |  Tags: , , , , , , ,   |  Organizations: ,
March 22, 2016

Spectrum analyzers aim for IoT projects

Tektronix has aimed a pair of RF instruments at the growing number of engineering teams trying to incorporate low-power wireless communications into their designs.
Article  |  Topics: Blog - Embedded, PCB  |  Tags: , , ,   |  Organizations:
July 13, 2015

GlobalFoundries tunes 28nm for smaller, lower-power FD-SOI

GlobalFoundries has developed variants of the 28nm FD-SOI process that offer smaller die sizes and lower-power operation.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
August 8, 2014

Custom instrumentation helps build models for more advanced RF amplifiers

High peak-to-average ratios inherent in 4G/5G modulation schemes are driving the circuitry controlling RF PAs to become more modeling-oriented.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , , , , ,   |  Organizations:
August 7, 2014

NI aims to bring design and production closer with chip-test plan

National Instruments plans to build an ecosystem around semiconductor test that could provide a missing link between the design process and production.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: ,

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