Cadence and Imec have worked together on a project to tape out a test chip to explore manufacturing and design-rule options for the interconnect on future 3nm processes.
The major West Coast technical conference for lithography is just two weeks away and offers a packed agenda.
At the 62nd annual IEDM taking place in early December two of the leading groups in process development will take the wraps off their 7nm finFET technologies.
According to ARM's Greg Yeric in his keynote at IEDM, even with cost improvements for multiple patterning, fewer designs will see the benefit of further silicon node scaling. Savings will come from design.
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
Is the industry ready to go beyond 10nm when it comes to lithography? Lithography researcher Professor David Pan sees design and process co-operation as the key approach.
Are we torn between evolution and revolution? Mentor Graphics' Joe Sawicki discusses how pattern matching already in fabs could move up and radically alter the design flow.
Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
View All Sponsors