monolithic 3DIC

December 18, 2023

FD-SOI processes lead to double-decker monolithic 3D

At IEDM, CEA-Leti described a process that avoids the thermal problems of implementing CMOS transistors in the metal stack using monolithic integration.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
October 5, 2023

Vertical integration expands at IEDM

Vertical integration is one of the major focus areas at the upcoming IEDM conference, both in terms of transistors and the multiple channels that will go into them.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
July 12, 2023

‘Two wafers are better than one’ for 3D flash

Western Digital's head of technology set out at the recent VLSI Symposium the ways in which flash makers can scale without costs accelerating.
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May 23, 2022

IEDM to celebrate 75 years of the transistor

Recognizing the 75th anniversary of the transistor in December, the 68th IEDM has taken on the theme of looking at “transformative devices to address global challenges”.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: ,
October 18, 2021

Three ways to 3D feature at IEDM

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: , , ,
June 16, 2021

Samsung moves further into 3D for denser flash

Samsung described at VLSI Symposia how it has used two further forms of stacking to increase flash capacity.
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June 4, 2021

IEDM looks for papers across 2D devices to 3DICs

IEDM has issued a call for papers for what the organizers expect to be an in-person event in December.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,
December 17, 2020

Macronix proposes 3D to breathe life back into NOR flash

At IEDM this year, Macronix showed how a 3D architecture may bring back NOR flash, which stopped scaling a decade ago.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations:
December 15, 2020

Chipmaking’s new environment presented at IEDM

Imec's senior vice president of CMOS outlined future directions for the technology over the coming decade.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations:
July 21, 2020

3D integration technologies will blend says TSMC chief scientist

DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: ,

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