Two leading European research institutes presented their work on the feasibility and cost-effectiveness of monolithic 3D integration at this year's IEDM.
X-Fab has added a process module to its wide voltage- and temperature-range 180nm mixed-signal process that supports a set of transistors with lower 1/f flicker noise.
An ASIC-based design has allowed Tektronix to build an oscilloscope that can mix and match analog and digital channels.
Cadence Design Systems and The Mathworks have implemented the first phase of an integration program to link tools such as Virtuoso ADE to Matlab.
Attacks using sound can upset accelerometers and make them produce false motion signals.
Xilinx plans to add high-speed analog interfaces to its upcoming FPGAs to better support high-density 5G basestation designs.
Webinar explores the impact of ISO 26262 on DFT requirements, and what is being learnt from the introduction of the standard at ON Semiconductor.
DVCon Europe this year provides a venue for extending UVM, SystemC and TLM for faster, more effective verification its organizing committee claims.
ARM aims to recruit more startups to develop IoT SoCs around the Cortex-M0 with design-house network and easier access to EDA tools.
The DATE 2016 conference saw the launch of a competition to encourage novel designs using MEMS technology.
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