internet of things

January 23, 2018

ARM DesignStart case study demonstrates scheme’s ease-of-use

ARM and Mentor describe a proof-of-concept project using free tools and IP to combine AMS and digital.
March 23, 2017

Leverage a zero-cost proof-of-concept platform for the IoT

ARM and Tanner EDA aim to chart a path toward cheaper, easier to realize designs for the embedded and Internet-of-Things markets.
March 13, 2017

Open-Silicon claims RISC-V ultra-low-power first

Implementation uses dedicated PULP technology in silicon for Green Waves Technologies on TSMC's 55nm LP process.
November 11, 2016

Webinar focuses on Eldo RF verification of Tanner-based designs

On-demand seminar explains how to exploit recently announced integration of Tanner and Eldo suites for sensor, IoT and other design types.
Article  |  Topics: Blog - EDA, - Product, Verification  |  Tags: , , , , , , ,   |  Organizations: ,
April 8, 2016

SNUG 2016: Aart de Geus looks beyond the linear design flow

Do the synapses in the human brain offer a new model for the design flow in a Smart Everything world?
March 11, 2016

GSA on how to reinvigorate silicon business models

Open-source hardware, in-field configurability, and a hardware-plus-services approach could protect margins as the IoT hammers down costs, says GSA report.
December 18, 2015

Accellera and Mentor’s Dennis Brophy talks standards targets and DVCon

Driving down energy consumption for the IoT, making portable stimulus deliver real benefits and the practical benefts of a globalizing DVCon.
September 22, 2015

IP and software portfolio introduced to speed IoT development

Low-power IP and software portfolio includes security hardware, Bluetooth and ISB interfaces, configurable processors and sensor subsystems
Article  |  Topics: Blog - IP  |  Tags: , , , , ,   |  Organizations:
June 10, 2015

TSMC adds Cadence and Imagination subsystems for IoT

Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
June 9, 2015

COMPUTEX 2015: Wrap II – New customers

Electronics design needs to cope with a combination of major brands and tiny start-ups looking to exploit its skills even where their resources are thin.
Article  |  Topics: Commentary, Conferences, Blog - EDA, IP, PCB  |  Tags: , , , ,   |  Organizations: , , , , ,

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