Cadence and Imec have worked together on a project to tape out a test chip to explore manufacturing and design-rule options for the interconnect on future 3nm processes.
IMEC and Cadence have taped out a test chip intended to explore key lithography and metal-interconnect issues that will face users of the forthcoming 5nm process node.
Process development alliance will enable Imec to experiment on 10 and 7nm processes in the computer before moving to the fab
EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
Plan around 193nm immersion lithography. Alternatives are years off and not guaranteed, says analyst group
View All Sponsors