finFET

Samsung Electronics expects to increase savings on die area in the shift from its 10nm to 7nm node by applying both EUV for critical layers and several layout-focused process changes.

Researchers from the UC Berkeley and Intel teamed up to develop an energy-tuneable RF front-end on a digital finFET process with no need for analog process options.

The circuits sessions at mid-June's VLSI Symposia in Honolulu feature a number of papers that improve the performance of scaled mixed-signal processes.

Samsung Electronics will describe at the upcoming VLSI Symposia how its engineers have applied EUV to a variety of layers in a 7nm finFET process.

Cadence Design Systems has made enhancements to its Virtuoso mixed-signal layout tool at both the system-level and nanometer-design levels for its 18.1 release.

As geometries have shrunk, layout-dependent effects in CMOS have become ever more problematic. They are not just popping up in performance but reliability and aging effects as one IEDM presentation showed.

Intel and GlobalFoundries will talk about their post-14nm finFET-based processes at December's IEDM.

GlobalFoundries intends to offer a 12nm FinFET process as a stepping stone from its 14nm process.

Placement-aware synthesis and an array of post-layout recovery steps have helped drive up the clock speed and silicon utilization of a series high-end SoCs on leading-edge processes developed by customers of Synopsys' implementation tools.

EUV and fin optimization help build Samsung's upcoming 7nm process, the company discloses at the VLSI Technology Symposium.