double patterning

February 11, 2016

SPIE Advanced Lithography Preview: Mentor Graphics

The Calibre vendor will have a strong technical presence at the leading lithography conference taking place in late February in San Jose.
December 11, 2015

IEDM keynote: cost scaling will swap architectural changes for area

According to ARM's Greg Yeric in his keynote at IEDM, even with cost improvements for multiple patterning, fewer designs will see the benefit of further silicon node scaling. Savings will come from design.
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June 18, 2015

The road to 7nm sees patterning multiply

Is the industry ready to go beyond 10nm when it comes to lithography? Lithography researcher Professor David Pan sees design and process co-operation as the key approach.
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June 16, 2015

Collaboration let HiSilicon accelerate 16nm finFET plans

HiSilicon claims close collaboration with foundry and EDA tools partners helped speed up plans to tape out the first 16nm finFET-based design through TSMC.
December 16, 2014

14nm/16nm finFETs debut at IEDM

The International Electron Device Meeting (IEDM) has once again provided a chance for the major chipmakers to go head-to-head with their latest processes - this time with finFETs.
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November 24, 2014

A57 finFET design underlines routing challenges

In a presentation at the recent ARM TechCon, HiSilicon described the issues in putting together a 16nm finFET-based design built around a cluster of ARM’s Cortex A57 processors.
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November 4, 2014

From Darwin to Mao: how multi-patterning could move up the flow

Are we torn between evolution and revolution? Mentor Graphics' Joe Sawicki discusses how pattern matching already in fabs could move up and radically alter the design flow.
October 3, 2014

ARM tools take aim at finFET layout, timing issues

ARM has launched a pair of tools designed to improve the density and performance of finFET designs that use the company's physical libraries.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , , , ,   |  Organizations:
September 11, 2014

TSMC: e-beam winning on cost over EUV for lithography

EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: , , , , , , ,   |  Organizations: , , ,
August 18, 2014

Power and clocking at 20nm force changes in FPGAs

Design for the 20nm generation of processes has revealed power and clocking issues for the two major FPGA manufacturers presentations at Hot Chips revealed.
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