communications


September 5, 2022

Parasitic extraction challenges intensify for 5G

5G IC designs have needed aggressive innovation across many elements and more use of FD-SOI that both pose parasitic extraction challenges.
Article  |  Topics: Blog - EDA, - Verification  |  Tags: , , , , , , , ,   |  Organizations:
July 19, 2022

Teledyne pushes for optical for remote RF heads

Teledyne e2v has demonstrated a prototype optical link that the company believes could replace electrical signaling for remote RF heads.
Article  |  Topics: Blog - PCB  |  Tags: , , , ,   |  Organizations:
November 12, 2014

Chip tariff eliminated and the big winner is… China?

Not just Intel and TI but also Lenovo and Huawei have cause to welcome end to 25% import tax. And could it even help reinvigorate Chinese start ups?

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