HiSilicon claims close collaboration with foundry and EDA tools partners helped speed up plans to tape out the first 16nm finFET-based design through TSMC.
For its Printed Electronics conference, IDTechEx pulled together a team together with P&G to develop a collaborative demonstration of the technology.
Future Horizon’s forecast meeting for the first half of 2013 made it clear how the electronics sector and the semiconductor industry in particular is facing big problems.
The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.
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