chiplet

December 5, 2023

Zero ASIC open sources system simulation/emulation platform

Start-up launches platform on path to the specification, emulation and simulation of large chiplet-based designs.
November 20, 2023

ETRI builds flow for AI chiplets

South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
Article  |  Topics: Blog - EDA, - HPC, Next Generation Design, Packaging, Verification  |  Tags: , , ,   |  Organizations: , ,
October 24, 2023

Flow evolution for the 3DIC/chiplet age

Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.
September 27, 2022

Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures

Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
Article  |  Topics: EDA - DFT  |  Tags: , , , , , , , , , ,   |  Organizations:
September 21, 2022

Nvidia proposes split-level link for chiplet interconnect

Nvidia revealed at its Fall GTC work the company has done on a bidirectional energy-saving chiplet interconnect that could hit the equivalent of 50Gbit/s per line.
Article  |  Topics: Blog - IP  |  Tags: , , , , ,   |  Organizations:
September 8, 2022

Module verification demands integrated DRC and LVS

The system-in-package and module trends in system design promote bringing together physical (DRC) and electrical (LVS) verification.
April 28, 2022

Go inside proposals for common chiplet models

Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.
March 23, 2022

Nvidia open to chiplet standards

Nvidia says it will support the UCIe chiplet interface standard once it has "stabilized" while opening up its latest form of NVLink to other companies.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations:
February 10, 2022

Capturing connectivity for assembly verification in 2.5D and 3D design

Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
Article  |  Topics: Verification  |  Tags: , , , , , , , , ,   |  Organizations:
February 8, 2022

How digital twin evaluations optimize STCO-based design

System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.

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