BEOL


December 5, 2018

Leti takes the heat off monolithic 3D

CEA-Leti claimed at IEDM to have achieved major steps in bringing monolithic 3D integration closer to production readiness.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
June 27, 2018

EDA needs to work on the back end, says Qualcomm

It’s the back-end that needs work as system-level considerations begin to dominate design, Qualcomm’s vice president of engineering said at DAC.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , ,   |  Organizations:
April 7, 2014

Latest ITRS underlines slowdown in interconnect and IC scaling

The 2013 edition of the International Technology Roadmap for Semiconductors has been published. The latest set of tables underlines the slowdown in some aspects of scaling, particularly when it comes to metal interconnect.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , ,
December 16, 2013

Qualcomm’s take on preserving Moore’s Law economics

Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.

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