Menta SAS has launched an embedded FPGA core family that improves density over previous versions.
Foundry strikes two more Internet of Things subsystem deals for its 55nm ULP process based on Cadence Tensilica and Imagination MIPS/PowerVR cores.
Gold Standard Simulations (GSS) has launched a tool intended to help fabless chipmakers squeeze more out of existing processes rather than accept the risk and expense of moving to more advanced, finFET-based processes.
S3 Group has launched the second in a family of low-power successive-approximation ADCs, with a design that supports sample rates up to 320MS/s.
Does the internet of things (IoT) require a change in design techniques? A number of people involved in the EDA industry reckon it does.
TSMC has launched three processes the foundry is aiming at internet-of-things (IoT) and wearable-device designs, providing lower-leakage versions of its 55nm, 40nm and 28nm processes.
Two of the custom designs presented at the 26th Hot Chips in Cupertino exemplified the problems caused by increasing power density and the benefits of looking at heat removal at the system level.
SAR analog-to-digital converters promise better energy efficiency for a growing range of designs, as S3 Group has found.
ARM and Synopsys both plan to make inroads to the internet of things with their IP strategies.
Globalfoundries will port Infineon Technologies’ flash technology to 40nm to support the manufacture of automotive and security microcontrollers (MCUs).
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