Intel and GlobalFoundries will talk about their post-14nm finFET-based processes at December's IEDM.
TSMC encapsulated the multiple chips assembled on a 1200mm2 silicon substrate to cut the chance of damage from warping with the company's CoWoS2 SiP technology.
Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
Cadence Design Systems has brought its chip- and PCB-design environments closer together as the shift towards multichip packages gains pace.
Machine learning, smarter cars, and the infrastructure to support a sixfold increase in IoT and edge devices have helped push up the number of teams doing finFET designs to more than 100, according to Tom Beckley of Cadence.
Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits.
Researchers at the Georgia Institute of Technology adapted conventional 2D layout tools to a two-layer monolithic 3D process that resulted in sizeable space and power savings.
The EDA Consortium is rebranding and extending its activities to better reflect all the tools and services that now comprise IC design.
Following Mentor's acquisition of Tanner EDA, management expect the integration will help with a drive into IoT applications and systems that need to go beyond standard IC lithography.
Altera is using a combination of Intel's 14nm process technology and multidie packaging to boost the logic-cell count for its FPGAs, together with a superpipelining strategy to help balance area and clock speed.
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