At the VLSI Technology Symposium a team led by STMicroelectronics described the techniques used for the upcoming 14nm FD-SOI to boost speed and density over the 28nm version.
Qualcomm will present at VLSI Technology Symposium 2014 a version of TSMC's 20nm technology that uses design and process tweaks to reduce the number of double-patterned layers.
But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.
TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
Research group CEA-Leti expects to have design kits ready for a 10nm FD-SOI process in June 2014
Cadence Design Systems has rolled out a new version of Virtuoso that deals with the physical-implementation issues that arise in the sub-28nm nodes.
Altera has disclosed a number of the features that will make it into the top end of its upcoming 'Generation 10' family of FPGAs.
The increasing use of graphics in mobile SoCs means that finFET processes need to be optimised for density and power - as well as early availability at low risk.
EDA companies are having to plan for the different ways in which double patterning and finFETs could move into fabs, Antun Domic of Synopsys explains.
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